Glass

By 355nm wavelength UV laser with typical optical module / component design, the glass sheet or glass wafer for multiple openings / ditching or cutting process .

Wafer

Using 355nm wavelength UV Lasers with optical module / element design for high speed and reduced edge debris processes for thin wafers (Si, GaAs, GaN ...), or using different wrapping techniques , the wafer can be obtained high aspect ratio of drilling / dicing process. Besides, by ultra-fast lasers such as picosecond laser or femtosecond laser , with the original light path design to achieve higher quality requirements.

Ceramic

Cutting, scribing or drilling for AlN and ceramic substrate of aluminum oxide.

TEL：03-5679088

FAX：03-5638529

ADD：300新竹科學工業園區園區二路56號1樓

ADD：1F,No.56~58,Park Ave.2,Science-Based Industrial Park Hsin Chu City,Taiwan 300, R.O.C.